According to media reports, TSMC is about to finalize its future 3nm and 2nm process customers, in addition to Apple, AMD, Nvidia, Broadcom, Mediatek and Qualcomm are also customers of its 3nm and 2nm chips.
According to the report, the output of TSMC's 3nm chips will increase quarter by quarter in 2024, and by 2025, TSMC will begin to officially produce 2nm chips.
And due to the increased difficulty of process technology and TSMC's one-stop service including back-end advanced packaging, its major customers for 3nm and 2nm processes are unlikely to shift orders or reduce production before 2027.
However, due to the short supply of TSMC's CoWoS production capacity, Samsung is also trying to obtain advanced packaging orders from Nvidia and other companies, as well as 7nm process orders.
But Nvidia's 2024 roadmap shows that it is still working to obtain CoWoS production capacity from TSMC, and has no plans to transfer orders to Samsung, Nvidia's cooperation with Samsung is still focused on memory chips, and has not yet determined whether to introduce Intel.
Nvidia CEO Jen-Hsun Huang, as well as executives from AMD, Qualcomm and Mediatek, have said that it is possible to cooperate with other foundries, but their primary goal is still to negotiate a price with TSMC.
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